Boron Nitride Ceramic Material Molding Molds

Material: Boron Nitride Ceramic (BN)

Specifications: Customizable according to customer requirements

Specifications and Parameters:

· Room Temperature Hardness (Shore): 86HS

· Bending Strength: 170 MPa

· Thermal Conductivity: 80-100 W/mK

· Density: 2.8~3 g/cm³

· Porosity: <10%

· Coefficient of Thermal Expansion: 5.4x10⁻⁶ K

· Maximum Operating Temperature in Air: ≤900°C

INQUIRY

Description

Product Features:

· Exceptional resistance to high-temperature oxidation, with strength almost unchanged at high temperatures.

· Thermal conductivity comparable to high-strength graphite.

· Strong machinability, balancing both strength and toughness.

· The material exhibits excellent thermal stability, wear resistance, and chemical inertness.

· Its high-temperature resistance and excellent thermal conductivity make it an ideal material for glass bending machine molds and smartphone screen forming molds.

· Boron Nitride Ceramic Molds A Replacement for High-strength Graphite

Application Scenarios and Uses: Mainly used in non-spherical/free-form (HUD) precision molding machines, 3D glass bending machines, and other related equipment.
The processing method involves placing flat glass substrates in molds, heating the equipment to soften the glass, and then forming it according to the precise curved shape of the mold cavity. Finally, the formed glass undergoes annealing and cooling to produce curved glass products such as smartphone screens, laptop screens and back covers, automotive central control screens, in-car HUD displays, AR-HUD mirrors, etc.